Supply and installation of an optical alignment and packaging system for UK semiconductor packaging operations supporting photonics and power electronics applications.
33 days left to bid. Opened today, deadline 4 Sept 2026.
Procurement of laser waveguide writing equipment to support UK sovereign semiconductor packaging capability for photonics applications.
University of Strathclyde is seeking a submicron flip-chip die bonding system to support advanced semiconductor packaging capabilities for UK photonics and power electronics innovators.
University of Strathclyde requires supply, installation, and commissioning of an automatic die inspection sorter for advanced semiconductor packaging in photonics applications.
Supply and install an optical transceiver tester to support UK-based semiconductor packaging and photonics assembly testing at the University of Strathclyde.
STFC is accepting applications from pre-qualified researchers for large research projects in physics and astronomy, covering 80% of full economic costs.
Develop and test innovative tools to measure public trust in policing, with focus on underrepresented groups and vulnerable populations across pilot areas.
Procurement of laser waveguide writing equipment to support UK sovereign semiconductor packaging capability for photonics applications.
University of Strathclyde is seeking a submicron flip-chip die bonding system to support advanced semiconductor packaging capabilities for UK photonics and power electronics innovators.
