Photonic Integrated Circuit Fabrication Service

This opportunity provides access to multi-project wafer (MPW) tape-out services for the design and fabrication of photonic integrated circuits. Suppliers and researchers can leverage shared wafer space to reduce costs and accelerate time-to-market for photonic devices. Services typically include design verification, lithography, etching, and delivery of functional photonic chips. This is ideal for companies and institutions developing optical communications, sensing, or signal processing applications who need production-ready photonic circuits without committing to full wafer runs.