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BidSonar is an independent index of public-sector opportunities. We aggregate data from official sources and are not affiliated with any procurement body. Data is licensed under the Open Government Licence v3.0 and the EU TED reuse notice.

    ContractsProcurement of Power Semiconductor Reliability Testing Equipment
    Closed contract

    Procurement of Power Semiconductor Reliability Testing Equipment

    Contract value
    £1m
    Closed 19 Aug 2026

    NCASP seeks supply, delivery, and installation of three specialized reliability testing chambers for semiconductor quality assurance and standards compliance.

    🇬🇧United Kingdom· ScotlandPublished 20 Jul 2026· 1 months agoviaFind a Tender
    Contract value
    £1m
    Closed 19 Aug 2026

    Decision brief

    4 fields
    • Contract value
      est.£1,000,000
      Pounds sterling
    • Tender closes
      19 Aug 2026
      Closes today
    • Sector
      Research & Innovation
      Browse related listings
    • Location
      🇬🇧United Kingdom
      Scotland

    Lifecycle

    Closed

    Tender closed on 19 Aug 2026. Awaiting award.

    20 Jul 202619 Aug 2026

    Brief

    The National Centre for Advanced Semiconductor Packaging (NCASP) is establishing a UK-based, open-access semiconductor packaging facility to address critical supply chain vulnerabilities and reduce reliance on overseas outsourced semiconductor assembly and test (OSAT) providers. This initiative aims to support UK innovators in photonics and power electronics by enabling domestic, high-volume packaging, testing, and metrology capabilities. To ensure packaged devices meet industry standards and quality requirements, NCASP is seeking suppliers for three reliability testing systems: (1) Climatic chamber for high temperature bias testing, (2) Climatic chamber for combined high temperature and high humidity bias testing, and (3) Thermal shock test chamber. Suppliers should have expertise in semiconductor reliability testing equipment, industry standards compliance, installation, and technical support to support a cutting-edge packaging facility.

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    Take action
    View on sourceFind a Tender

    Original closed notice on the publisher's site

    Publisher
    UK Cabinet Office
    Licence
    OGL v3.0
    Source
    find-tender.service.gov.uk
    Record ID
    ocds-h6vhtk-06cea6
    US
    Buyer
    University of Strathclyde
    Sector
    Research & Innovation