University of Strathclyde is seeking a submicron flip-chip die bonding system to support advanced semiconductor packaging capabilities for UK photonics and power electronics innovators.
32 days left to bid. Opened today, deadline 4 Sept 2026.
Procurement of laser waveguide writing equipment to support UK sovereign semiconductor packaging capability for photonics applications.
Supply and installation of an optical alignment and packaging system for UK semiconductor packaging operations supporting photonics and power electronics applications.
University of Strathclyde requires supply, installation, and commissioning of an automatic die inspection sorter for advanced semiconductor packaging in photonics applications.
Supply and install an optical transceiver tester to support UK-based semiconductor packaging and photonics assembly testing at the University of Strathclyde.
STFC is accepting applications from pre-qualified researchers for large research projects in physics and astronomy, covering 80% of full economic costs.
Develop and test innovative tools to measure public trust in policing, with focus on underrepresented groups and vulnerable populations across pilot areas.
Lead a research consortium to improve UK greenhouse gas inventory methodologies and emission factors for energy, waste, and industrial sectors.
Lead a research consortium to enhance the UK's greenhouse gas inventory for energy, waste, and industrial processes sectors using advanced emissions modelling and stakeholder engagement.
