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BidSonar is an independent index of public-sector opportunities. We aggregate data from official sources and are not affiliated with any procurement body. Data is licensed under the Open Government Licence v3.0 and the EU TED reuse notice.

    ContractsDie Inspection and Sorting Equipment for Semiconductor Packaging
    Closed contract

    Die Inspection and Sorting Equipment for Semiconductor Packaging

    Contract value
    £1.2m
    Closed 1 Sept 2026

    University of Strathclyde requires supply, installation, and commissioning of an automatic die inspection sorter for advanced semiconductor packaging in photonics applications.

    🇬🇧United Kingdom· ScotlandPublished 31 Jul 2026· 1 months agoviaFind a Tender
    Contract value
    £1.2m
    Closed 1 Sept 2026
    Tender deadline passed on 1 Sept 2026.

    Decision brief

    4 fields
    • Contract value
      est.£1,160,000
      Pounds sterling
    • Tender closed
      1 Sept 2026
      3 weeks ago
    • Sector
      Research & Innovation
      Browse related listings
    • Location
      🇬🇧United Kingdom
      Scotland

    Lifecycle

    Closed

    Tender closed on 1 Sept 2026. Awaiting award.

    31 Jul 2026Today1 Sept 2026

    Brief

    The University of Strathclyde seeks to procure and install an automatic die inspection sorter specifically designed for photonics packaging applications. This equipment supports the National Centre for Advanced Semiconductor Packaging (NCASP), a UK facility aimed at establishing sovereign semiconductor packaging and test capabilities. The sorter will enable domestic high-volume production of advanced semiconductors for photonics and power electronics, reducing reliance on overseas outsourced assembly and test facilities, minimizing supply chain fragmentation, shortening lead times, and protecting intellectual property. The successful supplier will be responsible for supplying the equipment, managing delivery to the University of Strathclyde, installing it within the NCASP facility, and commissioning it to operational readiness. This opportunity supports UK innovation in critical semiconductor technologies and strengthens domestic manufacturing capabilities.

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    Take action
    View on sourceFind a Tender

    Original closed notice on the publisher's site

    Publisher
    UK Cabinet Office
    Licence
    OGL v3.0
    Source
    find-tender.service.gov.uk
    Record ID
    ocds-h6vhtk-06d94d
    US
    Buyer
    University of Strathclyde
    Sector
    Research & Innovation