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    ContractsHermetic Sealing Equipment Supply and Installation for Semiconductor Packaging
    Closed contract

    Hermetic Sealing Equipment Supply and Installation for Semiconductor Packaging

    Tender closed
    1 Sept 2026
    10 weeks ago

    Supply and install advanced hermetic sealing equipment featuring seam sealing and projection welding capabilities for semiconductor packaging at the University of Strathclyde's National Centre for Advanced Semiconductor Packaging.

    🇬🇧United Kingdom· ScotlandPublished 30 Jul 2026· 3 months agoviaFind a Tender
    Tender closed
    1 Sept 2026
    10 weeks ago
    Tender deadline passed on 1 Sept 2026.

    Decision brief

    4 fields
    • Contract value
      Not disclosed
      Source did not declare a figure
    • Tender closed
      1 Sept 2026
      2 months ago
    • Sector
      Research & Innovation
      Browse related listings
    • Location
      🇬🇧United Kingdom
      Scotland

    Lifecycle

    Closed

    Tender closed on 1 Sept 2026. Awaiting award.

    30 Jul 2026Today1 Sept 2026

    Brief

    The University of Strathclyde seeks to establish advanced hermetic sealing capabilities as part of the National Centre for Advanced Semiconductor Packaging (NCASP), a UK initiative to develop sovereign semiconductor packaging and testing facilities. This requirement encompasses the supply, delivery, and installation of equipment capable of seam sealing and projection welding of hermetic packages used in photonic and advanced semiconductor applications. The equipment will support the facility's goal of providing UK innovators with domestic, high-volume packaging and assembly services, reducing supply chain fragmentation, shortening time-to-market, mitigating intellectual property risks, and strengthening UK technological sovereignty. Suppliers should demonstrate expertise in hermetic sealing technology, precision welding systems, and the ability to support advanced semiconductor packaging requirements. This is a critical infrastructure investment to retain UK semiconductor innovation capabilities and reduce reliance on overseas outsourced assembly and test providers.

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    Take action
    View on sourceFind a Tender

    Original closed notice on the publisher's site

    Publisher
    UK Cabinet Office
    Licence
    OGL v3.0
    Source
    find-tender.service.gov.uk
    Record ID
    ocds-h6vhtk-06d818

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    US
    Buyer
    University of Strathclyde
    Sector
    Research & Innovation