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    ContractsHermetic Sealing Equipment Supply and Installation for Semiconductor Packaging
    Open tender

    Hermetic Sealing Equipment Supply and Installation for Semiconductor Packaging

    Tender closes
    10d
    1 Sept 2026 · in 10 days

    Supply and install advanced hermetic sealing equipment featuring seam sealing and projection welding capabilities for semiconductor packaging at the University of Strathclyde's National Centre for Advanced Semiconductor Packaging.

    🇬🇧United Kingdom· ScotlandPublished 30 Jul 2026· 3 weeks agoviaFind a Tender
    Tender closes
    10d
    1 Sept 2026 · in 10 days

    Decision brief

    4 fields
    • Contract value
      Not disclosed
      Source did not declare a figure
    • Tender closes
      1 Sept 2026
      10 days left
    • Sector
      Research & Innovation
      Browse related listings
    • Location
      🇬🇧United Kingdom
      Scotland

    Lifecycle

    Open

    10 days left to bid. Opened 3 weeks ago, deadline 1 Sept 2026.

    30 Jul 2026Today1 Sept 2026

    Brief

    The University of Strathclyde seeks to establish advanced hermetic sealing capabilities as part of the National Centre for Advanced Semiconductor Packaging (NCASP), a UK initiative to develop sovereign semiconductor packaging and testing facilities. This requirement encompasses the supply, delivery, and installation of equipment capable of seam sealing and projection welding of hermetic packages used in photonic and advanced semiconductor applications. The equipment will support the facility's goal of providing UK innovators with domestic, high-volume packaging and assembly services, reducing supply chain fragmentation, shortening time-to-market, mitigating intellectual property risks, and strengthening UK technological sovereignty. Suppliers should demonstrate expertise in hermetic sealing technology, precision welding systems, and the ability to support advanced semiconductor packaging requirements. This is a critical infrastructure investment to retain UK semiconductor innovation capabilities and reduce reliance on overseas outsourced assembly and test providers.

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    Take action
    View tender on sourceFind a Tender

    Full notice and submission process on the publisher's site

    Publisher
    UK Cabinet Office
    Licence
    OGL v3.0
    Source
    find-tender.service.gov.uk
    Record ID
    ocds-h6vhtk-06d818
    US
    Buyer
    University of Strathclyde
    Sector
    Research & Innovation